CT 3D scanning visualizes semiconductor microstructures and measures geometric dimensions, enabling failure analysis and packaging process optimization.

3D CT scanning and rendering of microbumps clearly reveals bump morphology, height, and defects such as voids, missing bumps, and deformation.

Non-destructive CT reconstruction and visualization enables 3D detection and quantitative measurement of voids, delamination, and misalignment in wafers, 3D ICs, microbumps, TSVs, and MEMS—without sectioning, overcoming the limitations of destructive testing and localized inspection.