Industrial CT non-destructively removes occlusion from components and shielding layers, enabling 3D inspection and measurement of PCB/PCBA blind and buried vias, inner traces, solder joints, and underfill for defect detection, process optimization, and failure analysis.

Virtual slicing eliminates the need for physical sectioning, enabling layer-by-layer inspection of blind/buried vias, inner traces, solder joints, and underfill for rapid defect localization and root-cause analysis.

Porosity analysis non-destructively quantifies void volume, ratio, and distribution in PCB vias, solder balls, and underfill, supporting process evaluation and reliability assessment.