Delivers ultra-clear imaging for complex microstructures and hidden defects.
Handles plastics, composites, and dense metals with ease.
Supports larger samples without compromising image quality.
Accelerates analysis through AI-driven defect recognition and metrology.
From scanning to reporting, everything happens in one system.
Compatible with micro- and nano-focus X-ray sources, the system delivers ultra-high-resolution imaging to detect micro-cracks, pores, and delamination with exceptional clarity, enabling non-destructive inspection of semiconductors, precision electronics, and small castings.
High-energy X-ray imaging enables strong penetration of thick-walled, high-density metal and composite parts, delivering deep internal inspection for aerospace, heavy machinery, and large castings to detect hidden defects.
| IMAGING i 2000 | IMAGING i 2000pro | |
| Safety compliance | Self-shielding design, with a surface dose-rate of < 0.2 μSv/h | Self-shielding design, with a surface dose-rate of < 0.2 μSv/h |
| Max. tube voltage | 100 ~ 225 kV | 225~450 kV |
| Focal spot size | <2 μm | ≤7 μm |
| Max. field of view | 200 × 400 mm | 500 × 1000 mm |
| Max. sample size | <200 mm | ≤500 mm |
| Spatial resolution | 0.15/0.5/1 μm | ≤4 μm |
| Max. reconstruction matrix | 5000 × 5000 | 8000 × 8000 |
Raycision Empowers Research and Industry with Imaging and Radiation Solutions Tailored to Your Exact Needs.
